Description
Key Learnings
- 1. 正向设计应用点分析
- 2. 二三维协同技术方案及功能演示
- 3. 参数模块化的封装架构及应用实施方案
- 4. 房间标签功能下的数据收集与应用
Speaker
No transcript
No transcript
May we collect and use your data?
Learn more about the Third Party Services we use and our Privacy Statement.May we collect and use your data to tailor your experience?
Explore the benefits of a customized experience by managing your privacy settings for this site or visit our Privacy Statement to learn more about your options.