• CFD

Apply thermal dissipation to the large chip in an electronics enclosure model

Apply a heat dissipation to the large chip on the PCB of an electronics enclosure model.


00:03

To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.

00:13

This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)

00:20

to the large chip on a PCB.

00:23

Begin with Boundary Conditions selected on the Setup tab of the ribbon.

00:27

Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.

00:34

If needed, hide the exterior casing and air parts so you can access the internal components.

00:40

Press CTRL while middle-clicking both the casing and the air part to hide them.

00:45

Then, hide the heat sink that covers the large chip on the PCB.

00:50

Left-click to select the large chip.

00:53

Next, on the Setup tab, Boundary Conditions context panel, click Edit.

00:60

In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.

01:09

Set the Unit to W for Watts, then set the Total Heat Generation to 5.

01:14

Click Apply.

01:16

To verify that the heat condition is applied properly to the large chip, check the Design Study Bar.

01:22

Then, in the graphics window, ensure that the color of the stripe on the chip now matches the Total Heat Generation color in the legend.

01:31

With the heat dissipated by the chip properly set, the next step is to do the same for the capacitors.

Video transcript

00:03

To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.

00:13

This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)

00:20

to the large chip on a PCB.

00:23

Begin with Boundary Conditions selected on the Setup tab of the ribbon.

00:27

Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.

00:34

If needed, hide the exterior casing and air parts so you can access the internal components.

00:40

Press CTRL while middle-clicking both the casing and the air part to hide them.

00:45

Then, hide the heat sink that covers the large chip on the PCB.

00:50

Left-click to select the large chip.

00:53

Next, on the Setup tab, Boundary Conditions context panel, click Edit.

00:60

In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.

01:09

Set the Unit to W for Watts, then set the Total Heat Generation to 5.

01:14

Click Apply.

01:16

To verify that the heat condition is applied properly to the large chip, check the Design Study Bar.

01:22

Then, in the graphics window, ensure that the color of the stripe on the chip now matches the Total Heat Generation color in the legend.

01:31

With the heat dissipated by the chip properly set, the next step is to do the same for the capacitors.

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