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Apply a heat dissipation to the large chip on the PCB of an electronics enclosure model.
Transcript
00:03
To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.
00:13
This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)
00:20
to the large chip on a PCB.
00:23
Begin with Boundary Conditions selected on the Setup tab of the ribbon.
00:27
Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.
00:34
If needed, hide the exterior casing and air parts so you can access the internal components.
00:40
Press CTRL while middle-clicking both the casing and the air part to hide them.
00:45
Then, hide the heat sink that covers the large chip on the PCB.
00:50
Left-click to select the large chip.
00:53
Next, on the Setup tab, Boundary Conditions context panel, click Edit.
00:60
In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.
01:09
Set the Unit to W for Watts, then set the Total Heat Generation to 5.
01:14
Click Apply.
01:16
To verify that the heat condition is applied properly to the large chip, check the Design Study Bar.
01:22
Then, in the graphics window, ensure that the color of the stripe on the chip now matches the Total Heat Generation color in the legend.
01:31
With the heat dissipated by the chip properly set, the next step is to do the same for the capacitors.
00:03
To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.
00:13
This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)
00:20
to the large chip on a PCB.
00:23
Begin with Boundary Conditions selected on the Setup tab of the ribbon.
00:27
Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.
00:34
If needed, hide the exterior casing and air parts so you can access the internal components.
00:40
Press CTRL while middle-clicking both the casing and the air part to hide them.
00:45
Then, hide the heat sink that covers the large chip on the PCB.
00:50
Left-click to select the large chip.
00:53
Next, on the Setup tab, Boundary Conditions context panel, click Edit.
00:60
In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.
01:09
Set the Unit to W for Watts, then set the Total Heat Generation to 5.
01:14
Click Apply.
01:16
To verify that the heat condition is applied properly to the large chip, check the Design Study Bar.
01:22
Then, in the graphics window, ensure that the color of the stripe on the chip now matches the Total Heat Generation color in the legend.
01:31
With the heat dissipated by the chip properly set, the next step is to do the same for the capacitors.