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Apply a heat dissipation to small chips on the PCB of an electronics enclosure model.
Type:
Tutorial
Length:
2 min.
Transcript
00:03
To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.
00:12
This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)
00:20
to the small chips on a PCB.
00:23
Begin with Boundary Conditions selected on the Setup tab of the ribbon.
00:27
Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.
00:34
Now, you need to hide the exterior casing and air parts so you can access the internal components.
00:40
Press CTRL while middle-clicking both the casing and the air part to hide them.
00:46
Left-click to select the six small chips on the PCB.
00:50
Next, on the Setup tab, Boundary Conditions context panel, click Edit.
00:56
In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.
01:05
Set the Unit to W for Watts, then set the Total Heat Generation to 3.
01:10
Click Apply.
01:12
To verify that the heat condition is applied properly to the six chips, check the Design Study Bar.
01:18
Then, in the graphics window, ensure that the color of the stripe on each chip now matches the Total Heat Generation color in the legend.
01:27
With the heat dissipated by the chips properly set, the next step is to do the same for the large chip.
Video transcript
00:03
To prepare for running an electronics enclosure simulation in Autodesk CFD, you must first specify the physical characteristics of the model.
00:12
This includes defining boundary conditions, such as applying a heat dissipation (in the form of a volumetric heat generation)
00:20
to the small chips on a PCB.
00:23
Begin with Boundary Conditions selected on the Setup tab of the ribbon.
00:27
Chips are modeled as parts, so you also need to change the selection mode to Volume on the Selection panel.
00:34
Now, you need to hide the exterior casing and air parts so you can access the internal components.
00:40
Press CTRL while middle-clicking both the casing and the air part to hide them.
00:46
Left-click to select the six small chips on the PCB.
00:50
Next, on the Setup tab, Boundary Conditions context panel, click Edit.
00:56
In the Boundary Conditions quick edit dialog, under Property settings, verify that the Type is set to Total Heat Generation.
01:05
Set the Unit to W for Watts, then set the Total Heat Generation to 3.
01:10
Click Apply.
01:12
To verify that the heat condition is applied properly to the six chips, check the Design Study Bar.
01:18
Then, in the graphics window, ensure that the color of the stripe on each chip now matches the Total Heat Generation color in the legend.
01:27
With the heat dissipated by the chips properly set, the next step is to do the same for the large chip.
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